Structural electronics (SE) is one of the most important technological developments of this century. It forms a key part of the dream, formulated decades ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed. SE is often biomimetic – it usefully imitates nature in ways not previously feasible. It is a rapidly growing multi-billion dollar business.
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Structural electronics involves electronic and/or electrical components and circuits that act as load-bearing, protective structures, replacing dumb structures such as vehicle bodies or conformally placed upon them. It is of huge interest to the aerospace industry which is usually the first adopter, the automotive industry and in civil engineering both with compelling needs but its reach is much broader even than this. Electric cars badly need longer range and more space for the money and, in civil engineering, corrosion of reinforced concrete structures and tighter requirements for all structures, including early warning of problems, are among the market drivers for structural electronics.
The common factor is that both load bearing and smart skin formats occupy only unwanted space. The electronics and electrics effectively have no volume. More speculatively, electronics and electrics injected into unused voids in vehicle bodies, buildings etc., say as aerogel, could also provide this benefit without necessarily being load bearing but possibly providing other benefits such as heat insulation. Some present and future applications of structural electronics are morphing aircraft using shape memory alloys, car with printed organic light emitting diode OLED lighting on outside and inside of roof and printed photovoltaics over the outside generating electricity supercapacitor skin on an electric car replacing the traction battery as energy storage, smart skin as a nervous system for an aircraft and solar boats and aircraft running on sunshine alone. In London, a piezoelectric smart dance floor generates electricity and smart bridges across the world have sensors and more embedded in their concrete, all forms of structural electronics as it is increasingly the way to go.
1. EXECUTIVE SUMMARY AND CONCLUSIONS
1.1. Introduction
1.2. What is it?
1.3. Tackling urgent problems
1.4. Primary benefits
1.5. Maturity by applicational sector
1.6. Objectives and benefits
1.7. Materials and processes currently favoured
1.8. Smart skin
1.9. Component types being subsumed
1.10. Future proof
1.11. How to make structural electronics
1.11.1. A host of new technologies
1.12. Market forecasts
2. APPLICATIONS OF STRUCTURAL ELECTRONICS
2.1. Aerospace
2.2. Cars
2.3. Consumer goods and home appliances
2.4. Bridges and buildings
3. KEY FORMATS AND ENABLING TECHNOLOGIES
3.1. Basics
3.2. Detailed analysis
3.3. NASA leading the way
3.4. Early progress at plastic electronic
4. SMART SKIN
4.1. Description
4.2. Wire and cable smart cladding
4.3. Many other examples
4.4. NASA open coil arrays as electronic smart skin
4.5. American Semiconductor CLAS systems
4.6. BAE Systems UK: smart skin for aircraft then cars and dams
4.7. Composites evolve to add electronic functionality
4.7.1. Reasons, achievements, timeline 1940-2030
5. SOME KEY ENABLING TECHNOLOGIES
5.1. Smart materials
5.1.1. Comparisons, uses
5.1.2. Fiat car of the future
5.2. Printed and flexible electronics
5.2.1. Introduction and examples
5.2.2. Basic printed modules
5.2.3. Bendable then conformal photovoltaics
5.2.4. Printed electronics in structural electronics
5.3. 3D printing
5.3.1. Introduction
5.3.2. New materials
5.3.3. Adding electronic and electrical functions
5.3.4. The future
6. STRUCTURAL SUPERCAPACITORS AND BATTERIES
6.1. Many forms of structural supercapacitor
6.2. Fundamentals
6.3. Structural batteries and fuel cells
7. COMPANY PROFILES
7.1. Boeing, USA
7.2. Canatu
7.3. Neotech, Germany
7.4. Odyssian Technology, USA
7.5. Paper Battery Co., USA
7.6. Soligie
7.7. TactoTek, Finland
7.8. T-Ink IDTECHEX RESEARCH REPORTS AND CONSULTING
1.1. Global problems in certain applicational sectors
1.2. Benefits and challenges of structural electronics)
1.3. Benefits of structural electronics in different structures
1.4. Application patterns in current materials and processes
1.5. Criteria for a component to be most suitable for subsuming into SE
1.6. Some of the benefits of replacing conventional electronic and electric components and dumb structures with structural electronics by applicational sector most needing them
1.7. Very approximate estimate of the structural electronics market 2015 and 2025 $billion globally
1.8. Market forecast by component type for 2014-2024 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites 1.9. IDTechEx WSN forecast 2014-2024 with RTLS for comparison
1.10. Ten year forecasts for printed sensors (US$ million)
1.11. Electric vehicles market value (US$ billion) forecasts by vehicle type 2013-2025
3.1. Enabling technologies for present and future structural electronics
4.1. Example of demonstrated (in grey) and envisaged (in green) smart skin for inanimate objects and examples of organisations involved. Largest markets in red. Very approximate estimate of global market size 2025 $ billion.
4.2. NASA Sans EC open coil arrays as aircraft smart skin compared with metal mesh
4.3. Composites to electronic composites: objectives, achievements, future prospects 1940-2030
5.1. Examples of smart materials and their functions, challenges and potential uses in structural electronics
1.1. Some future applications of structural electronics
1.2. Maturity and sophistication of applications of structural electronics by sector showing strong adoption in yellow, intermediate in green and later adoption in magenta
1.3. Precursors of structural electronics in yellow, transitioning to established technology in green, and speculative dreams in magenta
1.4. Some possible structures of multilayer multifunctional electronic smart skin
1.5. Very approximate estimate of the structural electronics market 2015 and 2025 $billion globally
1.6. Market forecast by component type for 2014-2024 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites 1.7. Total WSN market $M
1.8. Market forecast for printed sensors to 2024 (in $ million)
2.1. Some applications and potential applications of structural electronics in aerospace
2.2. Smart composite actuator concept
2.3. Slotted Waveguide Antenna Stiffened Structure SWASS
2.4. Some applications and potential applications of structural electronics in cars
2.5. Supercapacitor car bodywork replaces traction batteries experimentally
2.6. Supercapacitor car trunk lid, experimental
2.7. Printed OLED lighting on and under car roof plus printed organic photovoltaics on the roof all as integrated structural electronics in a Daimler concept car 2.8. Some applications and potential applications of structural electronics in consumer goods and home appliances
2.9. Some applications and potential applications of structural electronics in bridges and buildings
2.10. Optimising setting of concrete using embedded sensors and sensors monitoring seismic damage and deterioration
3.1. Key formats and some key enabling technologies for structural electronics
3.2. Some of the enabling technologies for structural electronics and relationships between them
3.3. NASA nanotechnology roadmaps
3.4. NASA nanomaterials roadmap
3.5. NASA nanosensor roadmap
3.6. NASA biomimetics and bio-inspired systems
3.7. Project status at plastic electronic for different application segments
4.1. Supercapacitor smart skin on copper conducting wire or cable
4.2. NASA Sans EC open coil arrays (a) placed on aircraft (b) as array of laminar open circuit coils and (c) the shape of a typical coil used
4.3. American Semiconductor CLAS for aircraft
4.4. Flex ICs
4.5. Conformally attached FleX IC prototype with direct write flexible interconnects
4.6. Prototype smart skin
4.7. FleX transparent, thin, flexible CMOS
4.8. Envisioned production process for smart skin: conductor, insulator, simple display, power and flexibly mounted chips
4.9. Planned UAV trial of FleX smart skin
5.1. Fiat car of the future
5.2. Printed electronics power module developed under the European Community FACESS project
5.3. Types of early win and longer term project involving printed electronics 1995-2025
5.4. The Swedish Royal Institute of Technology (KTH) at the Shell Eco Marathon competition 2014
5.5. Cosmetic 3DP on structure
5.6. Timeline of 3DP applications
7.1. Spectrolab roadmap for multilayer cells
7.2. Odyssian technology that structurally integrates flex circuits and/or printed polymer circuits into conventional or composite structure often including conventional PCBs.